Gallant Micro. Machining CO., LTD.
Update：2026/09/15
Industries
Main Industry
Manufacturing
Main Product/Service
Semiconductor die sorting, die bonding, packaging, and dicing machines, etc.
(The content above was translated by AI.)
(The content above was translated by AI.)
Founded Year
2010
Unified Business No.
53186146
Status
Active
Number of Employees
0
Total Paid-in
Capital
289,115,000 (NT$)
Location of Company
Taiwan
, New Taipei City
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself.
Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
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About the Company
Gallant Micro. Machining CO., LTD. (GMM), established in 2010 (stock code: 6640), is headquartered in the Tucheng Industrial Park in New Taipei City. In 2017, the company purchased a factory in the Tai Yuen Hi-Tech Industrial Park in Hsinchu to establish an R&D center and cleanrooms, aiming to enhance services and collaboration with top semiconductor manufacturers such as Delta Electronics. Additionally, it set up an innovative R&D and manufacturing center in Suzhou, with service locations spanning Mainland China, Taiwan, Southeast Asia, and other regions.
The company is mainly engaged in the research and development, manufacturing, and sales of semiconductor-related production equipment and molds, and has obtained 73 Taiwanese patents and 31 Mainland Chinese patents. The company's core technologies and related main products include die sorters and die bonders utilizing precision pick-and-place technology; trim and form machines and automatic molding machines utilizing precision machining technology; and laser marking machines and optical inspection machines utilizing optoelectronic integration technology.
Gallant Micro. Machining CO., LTD. is constantly committed to the research and development of equipment for new process requirements, driving continuous improvement in technical capabilities and performance enhancements across its entire product line. By assisting customers in improving their competitiveness in securing orders through innovative product solutions, the company has earned high recognition from its clients. At the same time, it collaborates with government-affiliated research institutes and academic organizations to develop key technologies for advanced packaging equipment. It also combines the technological advantages of foreign key module manufacturers, leveraging outstanding integration capabilities to maximize R&D outcomes with limited resources, thereby establishing a solid foundation for profitability. Furthermore, due to years of technological accumulation, its core technologies hold a leading position in the domestic industry.
Since its establishment, the company has achieved profitability for ten consecutive years. Its customers include TSMC, SPIL, ASE, and other first-tier semiconductor manufacturers. With stable finances and operations, its technology leads domestic peers. The company continues to strengthen its core operational products and expand into the Mainland Chinese market. Through profitability, it fulfills its mission of sustainable operation and the beautiful vision of harmonious sharing. Recently, it has further invested in the development of advanced packaging equipment such as 3D IC, applying its core technologies to enter new markets such as electrical testing and 5G, grasping mainstream industry trends, and expanding its foundation for development.
Corporate Social Responsibility: Participating in the GOLF (Gap of Learning & Field) Alliance to help students connect with the industry in advance and strengthen their immediate readiness for the workplace.
(The content above was translated by AI.)
The company is mainly engaged in the research and development, manufacturing, and sales of semiconductor-related production equipment and molds, and has obtained 73 Taiwanese patents and 31 Mainland Chinese patents. The company's core technologies and related main products include die sorters and die bonders utilizing precision pick-and-place technology; trim and form machines and automatic molding machines utilizing precision machining technology; and laser marking machines and optical inspection machines utilizing optoelectronic integration technology.
Gallant Micro. Machining CO., LTD. is constantly committed to the research and development of equipment for new process requirements, driving continuous improvement in technical capabilities and performance enhancements across its entire product line. By assisting customers in improving their competitiveness in securing orders through innovative product solutions, the company has earned high recognition from its clients. At the same time, it collaborates with government-affiliated research institutes and academic organizations to develop key technologies for advanced packaging equipment. It also combines the technological advantages of foreign key module manufacturers, leveraging outstanding integration capabilities to maximize R&D outcomes with limited resources, thereby establishing a solid foundation for profitability. Furthermore, due to years of technological accumulation, its core technologies hold a leading position in the domestic industry.
Since its establishment, the company has achieved profitability for ten consecutive years. Its customers include TSMC, SPIL, ASE, and other first-tier semiconductor manufacturers. With stable finances and operations, its technology leads domestic peers. The company continues to strengthen its core operational products and expand into the Mainland Chinese market. Through profitability, it fulfills its mission of sustainable operation and the beautiful vision of harmonious sharing. Recently, it has further invested in the development of advanced packaging equipment such as 3D IC, applying its core technologies to enter new markets such as electrical testing and 5G, grasping mainstream industry trends, and expanding its foundation for development.
Corporate Social Responsibility: Participating in the GOLF (Gap of Learning & Field) Alliance to help students connect with the industry in advance and strengthen their immediate readiness for the workplace.
(The content above was translated by AI.)
