Uniconn Interconnections Technology Co., Ltd.
Update：2026/08/06
Industries
Main Industry
Hardware
Main Product/Service
Uniconn’s product portfolio includes advanced TF‑MLO substrates and packaging substrates used in high-performance computing (HPC), smartphones, IoT devices, automation systems, and consumer electronics. Their substrates feature fine-line design, high-aspe
Founded Year
2021
Unified Business No.
83201799
Status
Active
Number of Employees
0
Total Paid-in
Capital
577,191,660 (NT$)
Location of Company
Taiwan
, New Taipei City
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself.
Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
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About the Company
Uniconn Interconnections Technology Co., Ltd., founded in January 2021 and headquartered in Sanxia, New Taipei City, Taiwan, specializes in manufacturing IC test and packaging substrates. Leveraging expertise in both multilayer organic substrate (MLO) technology and semiconductor application, the company offers high-reliability solutions with a focus on quality, lead-time, and cost efficiency.
