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Startups

Main Industry
Hardware
Main Product/Service
Micro LED Technology Integration Services and Manufacturing
(The content above was translated by AI.)
Founded Year
2015
Unified Business No.
42837781
Status
Active
Number of Employees
3
Total Paid-in Capital
9,080,000 (NT$)
Location of Company
Taiwan , Taipei City
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself. Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
About the Company
ULTRA DISPLAY TECHNOLOGY CORP. was established in December 2015, with Chen Hsien-te as the person in charge. ULTRA DISPLAY TECHNOLOGY CORP. focuses on the research and development of mass-producible advanced technologies. Starting from the niche of micro-electronic device mass transfer technology, it vertically integrates upstream and downstream Micro LED manufacturers, equipment suppliers, and material suppliers, and continuously provides customers with integrated services for mass transfer technology. In addition, ULTRA DISPLAY TECHNOLOGY CORP. has completed the development of and actively promoted the "planar stamp pre-loaded with Micro LEDs" since 2018, providing manufacturer clients with mass transfer solutions and products with low-cost advantages, which have received recognition and high regard to date. The "planar stamp pre-loaded with Micro LEDs" is a product of ULTRA DISPLAY TECHNOLOGY CORP. Built on its proprietary mass transfer technology, it can flexibly respond to the needs of customers' different applications and batch-provide mass transfer stamps that meet the specifications required by manufacturing plants. Since the product itself contains a Micro LED array placed on the stamp body at intervals according to customer requirements, manufacturing plants can directly use flip-chip bonding equipment to perform the final bonding step of Micro LED mass transfer using the planar stamp, without bearing the risk of yield loss in the pre-process, which has the advantages of significantly reducing manufacturing costs, improving yield, and increasing production efficiency.
(The content above was translated by AI.)



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