Database

Startups

Main Industry
Hardware
Main Product/Service
Innovative Semiconductor Packaging Technology (WBCSP).
The content above was translated by Ai
Founded Year
2018
Unified Business No.
42986634
Status
Active
Number of Employees
0
Total capital
3,600,000 (NT$)
Location of Company
Taiwan , Hsinchu County
Website
Company names, registration status, legal representatives, founding years, paid-in capital, registered addresses, and other details are sourced from business registration records maintained by Taiwan’s Administration of Commerce, Ministry of Economic Affairs. Exit status includes Emerging Stock Board listings, M&A, and IPOs. Information on overseas expansion is self-reported by startups. Note 1: FINDIT compiles company information from public and other sources for reference and does not serve as a point of contact for the companies listed. Note 2: Some company profiles and product/service descriptions are translated using AI and provided for reference only. In case of discrepancies or ambiguity, the original text prevails.
About the Company
We provide an innovative packaging technology (WBCSP) that requires only 5 traditional packaging steps to complete WLCSP packaged products; this is an original technology.


The content above was translated by Ai
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