Database

Startups

Main Industry
Manufacturing
Main Product/Service
1. Laser
2. Micro LED
Founded Year
2017
Unified Business No.
58434601
Status
Active
Number of Employees
0
Total Paid-in Capital
1,406,315,130 (NT$)
Location of Company
Taiwan , Hsinchu County
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself. Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
About the Company
Since 2024, We Invited Silicon and Communication Talents to Join the Next Generation Optical Communications Development And Creating the Advanced CPO solutions.
bEMC will uphold the business philosophy of the most excellent quality, technology, service, and value. Engage photonics team, senior semiconductor and communication professionals joined to improve innovative technologies. bEMC provided optical communication 56G & 100G GaAs VCSEL and developed 1.3um and 1.5um EEL, empowering and accelerating the new generation of mobile phones, optical communications, data centers, and other industries. It will debut the world’s first 12-inch silicon wafer integrating high-bandwidth light source, targeting optical data communication speed at 1.6Tbps and above in 2025

Cooperate with Panel leaders to develop micro resonant cavity light-emitting diodes (Micro RC-LED). Through professional epitaxial structure design, we can control the light-emitting angle and provide high-brightness, high-efficiency, and high-contrast products to meet the specifications of automotive products.

Our vision is to provide the highest quality epitaxial wafers with cutting-edge laser structures. Become a leading optical light source supplier to meet the strong demand for emerging HPC, AI chips, and data centers.



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