ATTOPSEMI TECHNOLOGY CO., LTD.
Update：2026/08/06
Industries
Main Industry
Hardware
Main Product/Service
Attopsemi develops I-fuse® OTP memory IP for CMOS, HKMG, FD-SOI, and FinFET processes, offering small size, low power, high reliability, and strong data security. Its I-fuse® S3™ variant further reduces area and voltage, ideal for automotive, IoT, industr
Founded Year
2010
Unified Business No.
53054763
Status
Active
Number of Employees
0
Total Paid-in
Capital
153,972,500 (NT$)
Location of Company
Taiwan
, Hsinchu City
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself.
Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
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About the Company
Attopsemi Technology is a professional OTP intellectual property (IP) provider located in Hsinchu, Taiwan. Since found in 2010, the company has been dedicated to developing and licensing fuse-based OTP IP for all CMOS process, HKMG, FDSOI and FinFET technologies.
Attopsemi provides the best possible OTP solutions for all merits in small size, low voltage/current programming/read, high quality, high reliability, low power, high speed, wide temperature and high data security. Attopsemi’s proprietary I-fuse OTP have been proven in CMOS and other technologies from 0.7 um to 12 nm in numerous advanced foundries, and has been adopted by many customers in automotive, IoT, and other applications.
Attopsemi provides the best possible OTP solutions for all merits in small size, low voltage/current programming/read, high quality, high reliability, low power, high speed, wide temperature and high data security. Attopsemi’s proprietary I-fuse OTP have been proven in CMOS and other technologies from 0.7 um to 12 nm in numerous advanced foundries, and has been adopted by many customers in automotive, IoT, and other applications.
