RAYTEK SEMICONDUCTOR, INC.
Update：2026/08/06
Industries
Main Industry
Manufacturing
Main Product/Service
Our services include the following:
Wafer Distribution Layer (CuNiAu RDL & Cu RDL)
Copper Pillar Bump (CuP Bump)
Lead-Free Bump (LF Bump)
Wafer-level Chip Scale Package (WLCSP)
Application: Cellphones, TVs, printers, monitors, appliances, digit cards, se
Wafer Distribution Layer (CuNiAu RDL & Cu RDL)
Copper Pillar Bump (CuP Bump)
Lead-Free Bump (LF Bump)
Wafer-level Chip Scale Package (WLCSP)
Application: Cellphones, TVs, printers, monitors, appliances, digit cards, se
Founded Year
2016
Unified Business No.
45079229
Status
Active
Number of Employees
0
Total Paid-in
Capital
1,498,520,000 (NT$)
Location of Company
Taiwan
, Hsinchu County
Exit Status
Emerging Stock Exchange(2026)
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself.
Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
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About the Company
Raytek Semiconductor Inc. (abbreviated as Raytek) was funded in 2016, a high-tech semiconductor company dedicated to wafer-level packages. Raytek was established in Taiwan, and its vision is for the global market, focused on developing wafer-level packages and striving to be the most professional wafer-level RDL/Bumping supplier in Taiwan.
