RAYTEK SEMICONDUCTOR, INC.
Update：2026/11/10
Industries
Main Industry
Manufacturing
Main Product/Service
Our services include the following:
Wafer Distribution Layer (CuNiAu RDL & Cu RDL)
Copper Pillar Bump (CuP Bump)
Lead-Free Bump (LF Bump)
Wafer-level Chip Scale Package (WLCSP)
Application: Cellphones, TVs, printers, monitors, appliances, digit cards, se
Wafer Distribution Layer (CuNiAu RDL & Cu RDL)
Copper Pillar Bump (CuP Bump)
Lead-Free Bump (LF Bump)
Wafer-level Chip Scale Package (WLCSP)
Application: Cellphones, TVs, printers, monitors, appliances, digit cards, se
The content above was translated by Ai
Founded Year
2016
Unified Business No.
45079229
Status
Active
Number of Employees
0
Total Paid-in
Capital
1,498,840,000 (NT$)
Location of Company
Taiwan
, Hsinchu County
Exit Status
Emerging Stock Exchange(2026)
Company names, registration status, legal representatives, founding years, paid-in capital, registered addresses, and other details are sourced from business registration records maintained by Taiwan’s Administration of Commerce, Ministry of Economic Affairs. Exit status includes Emerging Stock Board listings, M&A, and IPOs. Information on overseas expansion is self-reported by startups.
Note 1: FINDIT compiles company information from public and other sources for reference and does not serve as a point of contact for the companies listed.
Note 2: Some company profiles and product/service descriptions are translated using AI and provided for reference only. In case of discrepancies or ambiguity, the original text prevails.
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About the Company
Raytek Semiconductor Inc. (abbreviated as Raytek) was funded in 2016, a high-tech semiconductor company dedicated to wafer-level packages. Raytek was established in Taiwan, and its vision is for the global market, focused on developing wafer-level packages and striving to be the most professional wafer-level RDL/Bumping supplier in Taiwan.
The content above was translated by Ai
