Database

Startups

Main Industry
Manufacturing
Main Product/Service
Products & Services
TSV Measurement Solutions
ViaMaster A200
TSV Metrology Module
TGV Measurement Solutions
TGV Viewer
Wafer / Film / Substrate Measurement Solutions
Filmuracy
The content above was translated by Ai
Founded Year
2024
Unified Business No.
93625959
Status
Active
Number of Employees
0
Total Paid-in Capital
182,620,000 (NT$)
Location of Company
Taiwan , Hsinchu County
Company names, registration status, legal representatives, founding years, paid-in capital, registered addresses, and other details are sourced from business registration records maintained by Taiwan’s Administration of Commerce, Ministry of Economic Affairs. Exit status includes Emerging Stock Board listings, M&A, and IPOs. Information on overseas expansion is self-reported by startups. Note 1: FINDIT compiles company information from public and other sources for reference and does not serve as a point of contact for the companies listed. Note 2: Some company profiles and product/service descriptions are translated using AI and provided for reference only. In case of discrepancies or ambiguity, the original text prevails.
About the Company
Founded in 2024, OmniMeasure Technology Inc. is dedicated to advancing measurement technologies, focusing on providing world-leading Through Silicon Via (TSV) and Through Glass Via (TGV) solutions.
Our TSV depth uniformity metrology for full wafers, critical dimension metrology, and film properties analysis tools effectively help users manage the quality of their most advanced chip production. Additionally, our newly announced TGV 3D Viewer can identify detailed via shape, critical dimensions, and via wall waviness or roughness. OmniMeasure’s optical innovations deliver non-destructive and high-throughput measurements, providing unparalleled value to our partners.

The content above was translated by Ai
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