SAULTECH TECHNOLOGY CO., LTD.
Update：2026/08/06
Industries
Main Industry
Manufacturing
Main Product/Service
1. Hybrid Bonding
2. Mini LED Display/Backlight/FOB
3. FOB Solution for Mini LED
4. Fan-Out Wafer Level Packaging (FOWLP)
5. Pick & Place Technology
2. Mini LED Display/Backlight/FOB
3. FOB Solution for Mini LED
4. Fan-Out Wafer Level Packaging (FOWLP)
5. Pick & Place Technology
Founded Year
2010
Unified Business No.
53058971
Status
Active
Number of Employees
0
Total Paid-in
Capital
306,025,870 (NT$)
Location of Company
Taiwan
, Hsinchu County
Exit Status
Emerging Stock Exchange(2021)
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself.
Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
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About the Company
Saultech Technology specializes in the innovation and development of Pick & Place technology and products. Our primary products include sorting machines and die-bonding machines, applicable to industries such as LED, LD, IC semiconductors, and optical glass. Our focus lies in the mid-to-late stage processes of chip sorting and die-bonding operations. Under the framework of the development of Pick & Place technology and products, we continuously expand collaborations with customers, channel partners, and industry peers. This collaborative effort aims to develop a variety of innovative and cost-effective equipment, establishing us as a provider of world-class Pick & Place products and technology.
