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新創企業

主要應用領域
Hardware
產品/服務
設計、開發並製造3D深度攝影機;3D AI中介軟體與應用
成立年份
2013
統一編號
54058540
公司狀態
營運中
負責人
劉凌偉
團隊人數
80
實收資本額
484,917,770 (元/新臺幣)
註冊地址
臺北市內湖區瑞光路100號2樓
企業名稱、公司狀態、負責人、成立年份、實收資本額、註冊地址等資料來源為經濟部商業發展署商工登記;出場狀況包括興櫃、M&A及IPO;海外發展為新創企業自行提供。 註:本平台係透過公開資訊蒐集等方式,將公司資料彙整於網頁中供各界查詢,非該公司聯繫人。
公司簡介
立普思LIPS於2013年由一群自麻省理工的團隊成立。我們專精於3D感測及Edge-AI技術,並且致力於全球領先的3D視覺與人工智能的解決方案。我們設計、開發並製造3D深度攝影機。另外,我們還發展各式各樣的3D AI中介軟體與應用去滿足客戶的需求。我們的不同之處來自於提供End-to-End的3D視覺與Edge-AI解決方案因應客戶的不同需求於各個產業上。立普思LIPS與許多世界知名的科技公司為一級的合作夥伴,像是: Intel, Panasonic, Toshiba, Texas Instrument, Sony, Melexis, CEVA 等等。



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抓取標籤API用

核心產品為「EDC 智慧物聯網系統」,整合資料蒐集、邊緣運算、分散式控制及設備管理等功能。系統採用自主開發的 vCAN 隨插即用總線技術,可快速串接各類感測器與控制設備,降低系統部署及整合成本;並結合邊緣設備雲、分散式控制架構及 RocksDB 時序資料庫,提供大量感測器資料的即時蒐集、處理與儲存能力。此外,平台支援 HTTP、Modbus TCP、BACnet 等開放式 API,可整合多元設備與混合雲架構,提升系統擴充性與跨平台整合能力。
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