Main Industry
Hardware
Main Product/Service
High-power semiconductor packaging service provider, vehicle pollution control and new energy conversion product business, and ceramic substrate and semiconductor packaging OEM product business.
(The content above was translated by AI.)
(The content above was translated by AI.)
Founded Year
2021
Unified Business No.
90428011
Status
Active
Number of Employees
0
Total Paid-in
Capital
10,000,000 (NT$)
Location of Company
Taiwan
, Taoyuan City
Company names, registration status, legal representatives, founding years, paid-in capital, registered addresses, and other details are sourced from business registration records maintained by Taiwan’s Administration of Commerce, Ministry of Economic Affairs. Exit status includes Emerging Stock Board listings, M&A, and IPOs. Information on overseas expansion is self-reported by startups.
Note 1: FINDIT compiles company information from public and other sources for reference and does not serve as a point of contact for the companies listed.
Note 2: Some company profiles and product/service descriptions are translated using AI and provided for reference only. In case of discrepancies or ambiguity, the original text prevails.
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About the Company
Sentec Green Technology Co., Ltd. is a high-power semiconductor packaging startup service provider. Our company possesses excellent packaging technology services, including automotive-grade nano-silver hot-press sintering process technology, which can provide modules with higher reliability and lower thermal resistance. At the same time, we possess a stable supply chain, such as chip resources and substrate resources from major manufacturers. Our company currently has 1200~1700V power modules that are pin-to-pin compatible with IGBTs available for industry reference. In response to the current promotion of localization in electric vehicle and green energy-related industries in various countries, our company can also provide localized production line support and services. Currently, we have supporting locations and production lines in Taiwan and China, while those in the United States, India, and Thailand are under planning.
Therefore, the Taiwanese startup company, Sentec Green Technology Co., Ltd., hopes to provide automotive-grade nano-silver hot-press sintering processing technology and related substrate peripheral passive components, among other in-production stock formulations, to offer power module OEM foundry services to Japanese semiconductor or system manufacturers, assisting clients in handling special cases, accelerating integration into the global green energy industry, and achieving carbon neutrality at an early date.
(The content above was translated by AI.)
Therefore, the Taiwanese startup company, Sentec Green Technology Co., Ltd., hopes to provide automotive-grade nano-silver hot-press sintering processing technology and related substrate peripheral passive components, among other in-production stock formulations, to offer power module OEM foundry services to Japanese semiconductor or system manufacturers, assisting clients in handling special cases, accelerating integration into the global green energy industry, and achieving carbon neutrality at an early date.
(The content above was translated by AI.)
