Advanced Pao Trusval Technology Co. , Ltd.
Update：2026/08/06
Industries
Main Industry
Manufacturing
Main Product/Service
High-end specialty chemicals used in advanced semiconductor packaging processes, including UV release tape and wafer dicing tape.
Founded Year
2025
Unified Business No.
60407669
Status
Active
Total Paid-in
Capital
495,800,000 (NT$)
Location of Company
Taiwan
, Taoyuan City
Information such as company name, company status, responsible person, year of establishment, paid-in capital, and registered address is sourced from the Commercial and Industrial Registration Office of the Ministry of Economic Affairs; listing status includes emerging stock, M&A, and IPO; overseas development is provided by the startup itself.
Notice: This data is compiled from public sources for reference only. We have no direct affiliation with the company and are not their contact person.
Exclusive content for members
Members-only content. Please log in to access.
About the Company
In response to advancements in AI and high-performance computing (HPC) packaging technologies, Advanced Pao Trusval Technology integrates semiconductor specialty materials, adhesive synthesis, and facility engineering technologies. Established in 2025 by AEMC (eChem), NAN PAO, and Shinhong Technology (6667), it focuses on the R&D and manufacturing of advanced semiconductor packaging adhesive materials such as UV debonding adhesives, wafer tapes, and protective films. The company aims to build a localized supply chain to meet the advanced packaging material needs of companies such as TSMC. It has established operations in the Southern Taiwan Science Park and acquired “Moli” to enhance production capabilities.
