Advanced Pao Trusval Technology Co. , Ltd.
Update：2026/11/10
Industries
Main Industry
Manufacturing
Main Product/Service
High-end specialty chemicals used in advanced semiconductor packaging processes, including UV release tape and wafer dicing tape.
The content above was translated by Ai
Founded Year
2025
Unified Business No.
60407669
Status
Active
Total Paid-in
Capital
517,330,000 (NT$)
Location of Company
Taiwan
, Taoyuan City
Company names, registration status, legal representatives, founding years, paid-in capital, registered addresses, and other details are sourced from business registration records maintained by Taiwan’s Administration of Commerce, Ministry of Economic Affairs. Exit status includes Emerging Stock Board listings, M&A, and IPOs. Information on overseas expansion is self-reported by startups.
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Note 2: Some company profiles and product/service descriptions are translated using AI and provided for reference only. In case of discrepancies or ambiguity, the original text prevails.
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About the Company
In response to advancements in AI and high-performance computing (HPC) packaging technologies, Advanced Pao Trusval Technology integrates semiconductor specialty materials, adhesive synthesis, and facility engineering technologies. Established in 2025 by AEMC (eChem), NAN PAO, and Shinhong Technology (6667), it focuses on the R&D and manufacturing of advanced semiconductor packaging adhesive materials such as UV debonding adhesives, wafer tapes, and protective films. The company aims to build a localized supply chain to meet the advanced packaging material needs of companies such as TSMC. It has established operations in the Southern Taiwan Science Park and acquired “Moli” to enhance production capabilities.
The content above was translated by Ai
